Last mentioned: Mar 18, 2026
Technical Validation
Expected period for technical validation of Samsung's 3nm GAA process for AMD designs.
CEO Site Visit
AMD CEO Lisa Su visits Samsung's chip plant in South Korea to discuss expanding ties.
MoU Signing
Samsung and AMD officially sign an MoU on AI memory and foundry exploration.
AMD and Samsung Electronics have signed a Memorandum of Understanding to collaborate on advanced AI memory solutions while exploring a broader foundry partnership. This strategic move aims to secure AMD's supply chain for high-performance computing and challenge TSMC's dominance in the AI chip manufacturing sector.
This page surfaces every story mentioning High Bandwidth Memory (HBM) across our supply chain coverage. We track each entity's appearance over time so readers can trace how the narrative evolves — which developments are isolated incidents, which build into longer arcs, and which reframe how operators in the space think about the entity. Story selection uses the same multi-source verification gate applied across the rest of our coverage.
Read our editorial methodology for how we identify, deduplicate, and score entity references. Our glossary defines the technical terms used across stories on this page, and our trends index contextualizes individual developments against the longer-running supply chain beat. Cross-entity comparisons live on our compare view.
| What you see | What it tells you |
|---|---|
| Story count | Number of distinct stories where High Bandwidth Memory (HBM) was a primary or referenced actor. |
| Recency clustering | Whether mentions are concentrated in a recent window (a news cycle) or distributed (a sustained arc). |
| Sentiment distribution | Aggregate sentiment of the stories mentioning this entity, weighted by impact score. |
| Cross-niche links | When the same entity surfaces in our sibling networks, we link to those views to enrich context. |