Last mentioned: 21h ago
Operational Launch
Expected start of commercial production for display driver chips.
Equipment Installation
Installation of specialized semiconductor assembly and testing machinery.
Construction Commencement
Initial site preparation and infrastructure development at the YEIDA site.
Groundbreaking Ceremony
Official commencement of construction for the NT$13.1 billion facility.
Foundation Stone Laid
PM Narendra Modi virtually lays the foundation for the India Chip Pvt Ltd facility.
Regulatory Approval
Indian government approves the project under the ISM incentive scheme.
JV Announcement
Foxconn and HCL Group announce plans for a semiconductor OSAT joint venture.
Hon Hai Precision Industry (Foxconn) and India's HCL Group have officially commenced construction on a joint venture semiconductor assembly and testing facility. The NT$13.1 billion project represents a major milestone in India's 'Make in India' initiative and Foxconn's strategic pivot toward South Asian manufacturing hubs.
Prime Minister Narendra Modi has laid the foundation stone for India Chip Pvt Ltd, a 60:40 joint venture between HCL Group and Foxconn in Greater Noida. The facility, focused on display driver chips, is a cornerstone of India's strategy to achieve semiconductor self-reliance by 2028.
A series of new trade restrictions and retaliatory tariffs are disrupting global logistics, forcing a pivot toward near-shoring and regionalized supply chains. Market volatility is increasing as companies race to front-load inventory before new duties take effect.