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Operational Launch
Expected start of commercial production for display driver chips.
Equipment Installation
Installation of specialized semiconductor assembly and testing machinery.
Construction Commencement
Initial site preparation and infrastructure development at the YEIDA site.
Implementation Phase
Anticipated start of joint working groups on semiconductor design and critical mineral extraction standards.
Pax Silica Formalization
India officially joins the initiative during the India AI Impact Summit in the presence of high-level US and Indian officials.
USISPF Endorsement
The US-India Strategic Partnership Forum issues a statement welcoming the move as a landmark step for economic security.
Foundation Stone Laid
PM Narendra Modi virtually lays the foundation for the India Chip Pvt Ltd facility.
Prime Minister Narendra Modi has laid the foundation stone for India Chip Pvt Ltd, a 60:40 joint venture between HCL Group and Foxconn in Greater Noida. The facility, focused on display driver chips, is a cornerstone of India's strategy to achieve semiconductor self-reliance by 2028.
India has officially joined the U.S.-led Pax Silica initiative, a strategic framework designed to secure semiconductor and AI supply chains. The partnership leverages India's vast rare earth reserves and U.S. technological leadership to build a resilient, trusted ecosystem for critical minerals and high-end manufacturing.